CVE-2022-33278

Memory corruption due to buffer copy without checking the size of input in HLOS when input message size is larger than the buffer capacity.

CVE-2023-28574

Memory corruption in core services when Diag handler receives a command to configure event listeners.

CVE-2023-33056

Transient DOS in WLAN Firmware when firmware receives beacon including T2LM IE.

CVE-2023-33066

Memory corruption in Audio while processing RT proxy port register driver.

CVE-2024-33012

Transient DOS while parsing the multiple MBSSID IEs from the beacon, when the tag length is non-zero value but with end of beacon.

CVE-2024-33015

Transient DOS while parsing SCAN RNR IE when bytes received from AP is such that the size of the last param of IE is less than neighbor report.

CVE-2021-1968

Improper validation of kernel buffer address while copying information back to user buffer can lead to kernel memory information exposure to user space in Snapdragon Auto, Snapdragon Compute, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon...

CVE-2022-33283

Information disclosure due to buffer over-read in WLAN while WLAN frame parsing due to missing frame length check.

CVE-2022-40507

Memory corruption due to double free in Core while mapping HLOS address to the list.

CVE-2023-21658

Transient DOS in WLAN Firmware while processing the received beacon or probe response frame.

CVE-2023-28578

Memory corruption in Core Services while executing the command for removing a single event listener.

CVE-2023-28585

Memory corruption while loading an ELF segment in TEE Kernel.

CVE-2023-33026

Transient DOS in WLAN Firmware while parsing a NAN management frame.

CVE-2023-33085

Memory corruption in wearables while processing data from AON.

CVE-2024-33020

Transient DOS while processing TID-to-link mapping IE elements.

CVE-2022-25687

memory corruption in video due to buffer overflow while parsing asf clips in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables

CVE-2022-33219

Memory corruption in Automotive due to integer overflow to buffer overflow while registering a new listener with shared buffer.

CVE-2022-33234

Memory corruption in video due to configuration weakness. in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Wearables

CVE-2022-33285

Transient DOS due to buffer over-read in WLAN while parsing WLAN CSA action frames.

CVE-2023-28538

Memory corruption in WIN Product while invoking WinAcpi update driver in the UEFI region.

CVE-2023-33014

Information disclosure in Core services while processing a Diag command.

CVE-2023-43519

Memory corruption in video while parsing the Videoinfo, when the size of atom is greater than the videoinfo size.

CVE-2024-33010

Transient DOS while parsing fragments of MBSSID IE from beacon frame.

CVE-2024-33014

Transient DOS while parsing ESP IE from beacon/probe response frame.

CVE-2024-33024

Transient DOS while parsing the ML IE when a beacon with length field inside the common info of ML IE greater than the ML IE length.

CVE-2022-25655

Memory corruption in WLAN HAL while arbitrary value is passed in WMI UTF command payload.

CVE-2023-21651

Memory Corruption in Core due to incorrect type conversion or cast in secure_io_read/write function in TEE.

CVE-2023-24852

Memory Corruption in Core due to secure memory access by user while loading modem image.

CVE-2023-24853

Memory Corruption in HLOS while registering for key provisioning notify.

CVE-2023-33109

Transient DOS while processing a WMI P2P listen start command (0xD00A) sent from host.

CVE-2023-43549

Memory corruption while processing TPC target power table in FTM TPC.

CVE-2024-33011

Transient DOS while parsing the MBSSID IE from the beacons, when the MBSSID IE length is zero.

CVE-2024-33018

Transient DOS while parsing the received TID-to-link mapping element of the TID-to-link mapping action frame.

CVE-2024-33019

Transient DOS while parsing the received TID-to-link mapping action frame.

CVE-2024-33025

Transient DOS while parsing the BSS parameter change count or MLD capabilities fields of the ML IE.

CVE-2022-22076

information disclosure due to cryptographic issue in Core during RPMB read request.

CVE-2022-25746

Memory corruption in kernel due to missing checks when updating the access rights of a memextent mapping.

CVE-2022-33235

Information disclosure due to buffer over-read in WLAN firmware while parsing security context info attributes. in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapd...

CVE-2022-40516

Memory corruption in Core due to stack-based buffer overflow.

CVE-2022-40523

Information disclosure in Kernel due to indirect branch misprediction.

CVE-2023-21659

Transient DOS in WLAN Firmware while processing frames with missing header fields.

CVE-2023-22666

Memory Corruption in Audio while playing amrwbplus clips with modified content.

CVE-2023-28567

Memory corruption in WLAN HAL while handling command through WMI interfaces.

CVE-2023-33054

Cryptographic issue in GPS HLOS Driver while downloading Qualcomm GNSS assistance data.

CVE-2023-33081

Transient DOS while converting TWT (Target Wake Time) frame parameters in the OTA broadcast.

CVE-2023-43548

Memory corruption while parsing qcp clip with invalid chunk data size.

CVE-2024-23363

Transient DOS while processing an improperly formatted Fine Time Measurement (FTM) management frame.

CVE-2024-23381

Memory corruption when memory mapped in a VBO is not unmapped by the GPU SMMU.

CVE-2024-49835

Memory corruption while reading secure file.

CVE-2021-1958

A race condition in fastrpc kernel driver for dynamic process creation can lead to use after free scenario in Snapdragon Auto, Snapdragon Connectivity, Snapdragon Mobile, Snapdragon Wearables